• Smart Phone Battery PCB Board
  • Smart Phone Battery PCB Board
  • Smart Phone Battery PCB Board
  • Smart Phone Battery PCB Board
  • Smart Phone Battery PCB Board
  • Smart Phone Battery PCB Board

Smart Phone Battery PCB Board

Structure: Metal Base Rigid PCB
Dielectric: FR-4
Material: Polyester Glass Fiber Mat Laminate
Application: Consumer Electronics
Flame Retardant Properties: V0
Processing Technology: Electrolytic Foil
Samples:
US$ 20/Piece 1 Piece(Min.Order)
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Customization:

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Basic Info.

Model NO.
XJYPCB-503
Production Process
Subtractive Process
Base Material
Copper
Insulation Materials
Epoxy Resin
Surface Finishing
Lf-Hal
Copper Thickness
1oz
Board Thickness
1.6mm
Min. Hole Size
0.25mm
Min. Line Wigth
0.15mm
Min. Line Spacing
0.15mm
Color
Green
Size
35*45mm
Certificate
RoHS, UL, SGS, Ect
Package
Vacuum
Transport Package
Vacuum Package
Specification
Normal
Trademark
XJYPCB
Origin
China
HS Code
85340090
Production Capacity
8000square Meters Per Month

Product Description

                    

WELCOME TO XJYPCB
    
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Quick Details

Place of Origin:

Guangdong China (Mainland)

Brand Name:

XJY

Model Number:

xjy-pcb 060

Number of Layers:

1-20layer

Base Material:

fr4

Copper Thickness:

1oz

Board Thickness:

1.6mm

Min. Hole Size:

0.2mm

Min. Line Width:

0.1mm

Min. Line Spacing:

0.1mm

Surface Finishing:

hasl

certificates:

rohs,iso,ul

solder mask:

Green

Layer:

2layer

Application:

electronic

packing:

vacuum packing

shipping way:

DHL,FEDEX...

delievery time:

4-5days

sample time:

24hours,48hours,96hours...

pcb size:

customized

silk screen:

white



Certification: UL, RoHS, ISO9001: 2000
Board Thickness: 0.2MM-2.4MM
Min. Hole Size: 0.2MM
Min. Line Width: 0.15MM
Min. Line Spacing: 0.2MM
Surface Finishing: LF-HAL
Solder Mask Type: Green
Silkscreen: White
UL, IOS9001, RoHS

Quick lead time 24hours for 2-4layer PCB


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Technology capability 

 Items
 Single/Double-sided Board/Multilayer Board/FPC(1-24Layer)
 Base Materials   FR-4(High TG 150°-170°),FR1,Aluminum,CEM-3,BT,94vo
 Finish copper thickness   Outer 6 OZ,Inner 4 OZ
 Surface finish   ENIG, ImAg, ImSn, OSP, HASL,Plating gold
 Finished Board Size  Max Double-sided Board  640mm χ 1100mm
 Max Multilayer Board  640mm χ 1100mm
 Finished Board Hole Size (PTH Hole)  Min Finished Board Hole Size  0.15mm
 Conductor Width and Spacing  Min Conductor Width  0.01mm
 Min Conductor Spacing  0.01mm
 Thickness of Plating and Coating Layer  PTH Wall Copper Thickness  >0.02mm
 Tin Solder Thickness ( Hot  Air Leveling )  >0.02mm
 Nickl/Gold Thickness  For customer special need
 Nickl Plating Layer  >2um
 Gold Plating Layer  >0.3um
 Bare Board Test  Single Side Test  Max Test Point  20480
 Max Board Test Size  400mm χ 300mm
 Double Side Test      Max Test Point  40960(General Use)
 4096(Special Use)
 Max Board Test Size  406mm χ 325mm
 320mm χ 400mm
 Min Test pitch of SMT  0.5mm
 Test Voltage  10-250V
 Mechanical Process              Chamfer  20°, 30°, 45°, 60°
 Angle Tolerance  ± 5°
 Deepness Tolerance  ± 0.20mm
 V-Cut Angle  20°, 30°, 45°
 Board Thickness  0.1-3.2mm
 Residues Thickness  ± 0.025mm
 Cell Paraposition Precision  ± 0.025mm
 Tolerance of Out-shape Process  ± 0.1mm
 Board Warp  Max Value  0.7%
 Optical Plotting  Max Plotting Area  66mm χ 558.8mm
 Precision  ± 0.01mm
 Repetitive Precision   ± 0.005mm
 

 
 
If you were interested in our products, welcome to enquiry.We'll give you detail introduction and the best price. We do hope we can have a good longterm business relationship.
  Smart Phone Battery PCB Board Smart Phone Battery PCB Board
  Smart Phone Battery PCB Board Smart Phone Battery PCB Board Smart Phone Battery PCB Board
 
 

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Terms of Payment
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