LED Aluminum PCB, Metal Core Alu PCB,

• Metal Coating: Copper
• Mode of Production: SMT
• Layers: Multilayer
• Base Material: FR-4
• Certification: RoHS, ISO
• Customized: Customized
• Model NO.: XJY-PCB
• Condition: New
• Layer No: 1 to 20
• Legend Color: Black or Customized
• Surface Treatment: Varible According to Your Product
• Type: Aluminum PCB
• Min. Line Width: 0.075mm
• Min.Line Spacing: 0.075mm
• Min. Hole Size: 0.15mm
• Board Thickness: 0.2mm-6.0mm
• Copper Thickness: 1oz or Customized
• Transport Package: Vacuum Plastic for PCB; Anti-Static Bag for PCBA
• Trademark: XJY-PCB
• Origin: China
• HS Code: 85340090
• Production Capacity: 30000 Square Meter/Square Meters Per Month

Product Description

 
Quick Details
Place of Origin: Chongqing, China (Mainland)
Brand Name: XJYPCB
Model Number: XJY-LFL10738
Base Material: FPC, PI,FR-4,94vo,High-frequency,Cu-base, Al-base
Copper Thickness: 1oz or customized
Board Thickness: 0.2mm-6.0mm
Min. Hole Size: 0.15mm
Min. Line Width: 0.075mm
Min. Line Spacing: 0.075mm
Surface Finishing: HASL,ENIG,Immersion Tin,OSP,Flash Gold,Gold finger
Layer Counts: 1-24
Material: 1 pcs
solder mask Color: color: white or customized
Certificate: UL, RoHS, SGS, ISO9001,ISO14001
Packing: Strong and safety
legend color: black or customized
surface treatment: variable according to your product
Sample: available .
Urgent service: 24 hours
Type: aluminum pcb
AL MC PCB

Technology capability 

Item	Capability	Item	Capability
Layers	1-28	Thicker Copper	1-6oz
Products Type	HI(High-Frequency)&(Radio Frequency) board, Imedance controlled board,HDI board, BGA& Fine pitch board	solder mask	Nanya&Taiyo, LPI&Matt red, green,yellow,white,blue,black.
Base Material	FR4(Shengyi China, ITEQ, KB A+,HZ),HI-TG,Fr06,Rogers,Taconic,Argon,Naclo,Isola and so on	Finished Surface	Conventional HASL, Lead-Free HASL,Flash Gold,ENIG(Immersion Gold),OSP(Entek),Immersion Tin, Immersion Sliver, Hard Gold
Selective Surface Treatment	EING(Immersion Gold)+OSP, ENIG(Immersion Gold)+Gold Finger, Flash Gold Finger, Immersion Sliver+Gold Finger, Immersion Tin+Gold Finger
Technical Specification	Minimum line width/gap	3.5/4mil(laser dirll)
	Minimum line width/gap	0.15mm(mechanical dirll) 4mil(laser dirll)
	Minimum Annular Ring	4mil
	Max Copper Thickness	6oz
	Max Production Size	600mm*800mm
	Board Thickness	D/S:0.2-7.0mm, Multilayer:0.4-7.0mm
	Min Solder Mask Bridge	≥0.08mm
	Aspect Ratio	15:1
	Plugging Vias Capability	0.2-0.8mm
Tolerance	Minimum line width/gap	±0.08mm(min±0.05)
	Non-Plated Hole Tolerance	0.15mm(mechanical dirll) 4mil(laser dirll)
	Outline Tolerance	±0.15mil(min±0.10mm)
	Functional Test
	Insulating Resistance	50ohms(normality)
	Peel Off Strength	1.4N/mm
	Thermal Stress Test	265ºC,20seconds
	Solder Mask Hardness	6H
	E-test Voltage	500V+15/-0V  30s
	Warp and Twist	0.7%(Semiconductor test board 0.3%)

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