Quick Turn Aluminium Base PCB Board

• Customization: Available
• Type: Rigid Circuit Board
• Flame Retardant Properties: V0
• Model NO.: XJY-PCB 178
• Dielectric: FR-4
• Base Material: Aluminum
• Insulation Materials: Organic Resin
• Processing Technology: Electrolytic Foil
• Application: Medical Instruments
• Mechanical Rigid: Rigid
• Material: Aluminum
• Brand: Xjy
• Side: Single
• for: LED
• Copper Thickness: 1
• Board Thickness: 1.6mm
• Min. Hole Size: 0.25mm
• Min. Line Width: 6mil
• Min. Line Spacing: 6mil
• Surface Finishing: Hal
• Soldermask: White
• Legend: Black
• Transport Package: Vacuum Package
• Specification: RoHs, UL
• Trademark: XJY
• Origin: China
• HS Code: 85340090
• Production Capacity: 20000 Square Meter/Week

Product Description

Welcome to XJY-----------


     Shenzhen Xinjiaye Electronics Technology Co., Ltd is a professional pcb manufacturer has over 10 years experience. We are able to offer 1 to 24 Layer PCB, ranging from pcb produce, components purchase, pcb assembly, pcb copy service.Our products are widely used in communication apparatus, automobile electronics, auto parts, computers, medical devices, light systems, outdoor systems, network devices and consumer electronics class fields.



Quick Details

 

Place of Origin:	shenzhen China (Mainland)	Brand Name:	XJY	Model Number:	1-L
Base Material:	aluminum	Copper Thickness:	1	Board Thickness:	1.6mm
Min. Hole Size:	0.25mm	Min. Line Width:	6mil	Min. Line Spacing:	6mil
Surface Finishing:	HAL	soldermask:	white	legend:	black
Outline:	CNC	Testing way:	E-testing

Specifications
1.1L aluminum PCB;
2.good quality,reasonable price;
3.quicker delivery;
4.better logistic service;
5.UL,SGS,ROHS,ISO9000


Specification
This form is of my company's process capacity for your reference, for more messages, pls contact with us freely!

Item	Specification
Material	FR-4 / Hi-Tg FR-4 / Lead free Materials(RoHS Compliant)/CEM-3/CEM-1/Aluminium
Layer	single layer,double layer,multi-layer(4-10)
Board Thickness	0.3mm-3.0mm,+/-0.1mm(tolerance)
Copper Thickness	1/2OZ-3OZ (35um to 105um),+/-8um(tolerance),purity 99.5%
Impedance Control	±10%
Bow and Twist MAX.	0.75%(SMT)
Anti-strip	0.88N/mm
Resistance	≤20Ω
Reactance	500V
Min. Value
Min. Trace/Space Width	6 mil,+/-0.15mm(tolerance)
SMD Pitch	10 mil
BGA Pitch	20 mil
Min Pad Space	4mil(SMT)
Plating Copper Thickness	15um
Hole
Hole Size	0.25mm--6.2mm
Hole Position Tolerance	±0.1mm
PTH/NPTH Tolerance	±0.15mm(dia.=0.4-1.4mm)
Pad Tolerance	±0.1mm(dia.≥0.6mm)
Pad to hole/to pad Tolerance	±0.05mm/±0.2mm
Solder Mask
Pad no Open	soldermask must cover all on both side, reject tin on pad
Pad Open	reject soldermask inside the hole on both side
Solder Mask Thickness	0.7mil,raised H≤0.05
Colour	green,blue,red,yellow,black,white(LPI/MATT.,UL 94 V0 approved)
Surface Finish
HAL	tin height≤0.05mm
ENIG	Nickel  3-7um,gold:0.5-0.7um
OSP/flash gold	0.2-0.5um
Pealable mask	cover all on pad,thickness≥0.20mm
Carbon Ink	cover all on trace,Value≤30Ω
Outline
Outline Tolerance	±0.2mm
Beveling	30°,45°
V-cut position/depth	±0.2mm(length≤100mm)/±0.2mm
Punch	±0.1mm
E-testing pass percent	97% pass for the first time,+/-2%(tolerance)
Certificate	SGS,ISO,ROHS,UL,