Customization: | Available |
---|---|
Type: | Rigid Circuit Board |
Dielectric: | FR-4 |
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Brand Name: | XJY |
Model Number: |
xjy-pcb 105 |
Base Material: |
fr4 |
Copper Thickness: |
0.5-4.0oz |
Board Thickness: |
0.2mm-7mm |
Min. Hole Size: |
0.25mm |
Min. Line Width: |
0.075mm(3mil) |
Min. Line Spacing: |
0.075mm(3mil) |
Surface Finishing: |
HALS/HALS lead free |
Certificate: |
UL,ISO9001,ISO14001,ROHS,CQC |
Solder mask color: |
green/black/white/red/blue/yellow |
Inner packing: |
Vacuum packing,Plastic bag |
Outer packing: |
Standard carton packing |
Hole tolerance: |
PTH:±0.076,NTPH:±0.05 |
Profiling Punching: |
Routing,V-CUT,Beveling |
Assembly Service: |
Providing OEM service to all sorts of printed |
Items |
Single/Double-sided Board/Multilayer Board/FPC(1-24Layer) | ||
Base Materials | FR-4(High TG 150°-170°),FR1,Aluminum,CEM-3,BT,94vo | ||
Finish copper thickness | Outer 6 OZ,Inner 4 OZ | ||
Surface finish | ENIG, ImAg, ImSn, OSP, HASL,Plating gold | ||
Finished Board Size | Max Double-sided Board | 640mm χ 1100mm | |
Max Multilayer Board | 640mm χ 1100mm | ||
Finished Board Hole Size (PTH Hole) | Min Finished Board Hole Size | 0.15mm | |
Conductor Width and Spacing | Min Conductor Width | 0.01mm | |
Min Conductor Spacing | 0.01mm | ||
Thickness of Plating and Coating Layer | PTH Wall Copper Thickness | >0.02mm | |
Tin Solder Thickness ( Hot Air Leveling ) | >0.02mm | ||
Nickl/Gold Thickness | For customer special need | ||
Nickl Plating Layer | >2um | ||
Gold Plating Layer | >0.3um | ||
Bare Board Test | Single Side Test | Max Test Point | 20480 |
Max Board Test Size | 400mm χ 300mm | ||
Double Side Test | Max Test Point | 40960(General Use) | |
4096(Special Use) | |||
Max Board Test Size | 406mm χ 325mm | ||
320mm χ 400mm | |||
Min Test pitch of SMT | 0.5mm | ||
Test Voltage | 10-250V | ||
Mechanical Process | Chamfer | 20°, 30°, 45°, 60° | |
Angle Tolerance | ± 5° | ||
Deepness Tolerance | ± 0.20mm | ||
V-Cut Angle | 20°, 30°, 45° | ||
Board Thickness | 0.1-3.2mm | ||
Residues Thickness | ± 0.025mm | ||
Cell Paraposition Precision | ± 0.025mm | ||
Tolerance of Out-shape Process | ± 0.1mm | ||
Board Warp | Max Value | 0.7% | |
Optical Plotting | Max Plotting Area | 66mm χ 558.8mm | |
Precision | ± 0.01mm | ||
Repetitive Precision | ± 0.005mm |