| Customization: | Available |
|---|---|
| Structure: | Multilayer Rigid PCB |
| Dielectric: | FR-4 |
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| Items | Single/Double-sided Board/Multilayer Board/FPC(1-24Layer) | ||
| Base Materials | FR-4(High TG 150°-170°),FR1,Aluminum,CEM-3,BT,94vo | ||
| Finish copper thickness | Outer 6 OZ,Inner 4 OZ | ||
| Surface finish | ENIG, ImAg, ImSn, OSP, HASL,Plating gold | ||
| Finished Board Size | Max Double-sided Board | 640mm χ 1100mm | |
| Max Multilayer Board | 640mm χ 1100mm | ||
| Finished Board Hole Size (PTH Hole) | Min Finished Board Hole Size | 0.15mm | |
| Conductor Width and Spacing | Min Conductor Width | 0.01mm | |
| Min Conductor Spacing | 0.01mm | ||
| Thickness of Plating and Coating Layer | PTH Wall Copper Thickness | >0.02mm | |
| Tin Solder Thickness ( Hot Air Leveling ) | >0.02mm | ||
| Nickl/Gold Thickness | For customer special need | ||
| Nickl Plating Layer | >2um | ||
| Gold Plating Layer | >0.3um | ||
| Bare Board Test | Single Side Test | Max Test Point | 20480 |
| Max Board Test Size | 400mm χ 300mm | ||
| Double Side Test | Max Test Point | 40960(General Use) | |
| 4096(Special Use) | |||
| Max Board Test Size | 406mm χ 325mm | ||
| 320mm χ 400mm | |||
| Min Test pitch of SMT | 0.5mm | ||
| Test Voltage | 10-250V | ||
| Mechanical Process | Chamfer | 20°, 30°, 45°, 60° | |
| Angle Tolerance | ± 5° | ||
| Deepness Tolerance | ± 0.20mm | ||
| V-Cut Angle | 20°, 30°, 45° | ||
| Board Thickness | 0.1-3.2mm | ||
| Residues Thickness | ± 0.025mm | ||
| Cell Paraposition Precision | ± 0.025mm | ||
| Tolerance of Out-shape Process | ± 0.1mm | ||
| Board Warp | Max Value | 0.7% | |
| Optical Plotting | Max Plotting Area | 66mm χ 558.8mm | |
| Precision | ± 0.01mm | ||
| Repetitive Precision | ± 0.005mm | ||
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