HASL Lf HDI Buried Blind Print Circuit Board PCB

• Type: Rigid Circuit Board
• Dielectric: FR-4
• Material: Fiberglass Epoxy
• Application: Medical Instruments
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Model NO.: XJY-PCB 027
• Processing Technology: Electrolytic Foil
• Base Material: Fr4
• Insulation Materials: Organic Resin
• Copper Thickness: 1oz
• PCB Board Thickness: 1.6mm
• PCB Solder Mask: Yellow
• PCB Silk Screen: White
• PCB Surfaceing: HASL
• Min Line: 0.16mm
• Min Hole Size: 0.2mm
• Min. Line Spacing: 0.12mm
• Min. Line Wigth: 0.2mm
• Pack: Vacuum Packing
• Transport Package: Vacuum Package
• Specification: Normal
• Trademark: OEM
• Origin: China
• HS Code: 85340090
• Production Capacity: 10000sqm/Month

Product Description

HASL LF HDI Buried Blind Print Circuit Board PCB

Board Thickness: 1.6MM
Surface Finishing: HASL
Certification: UL, RoHS, ISO9001: 2000, SGS
Solder Mask Type: Yellow
Silkscreen: White

We are in the line of PCB manufacturing in Shenzhen city supplying all kinds of PCB with good quality, sincere service and competitive price.
What's more, we can save more time and cost for you. Pls feel free to send us your enquiry.
We have passed SGS, ISO9001, ISO14001 and UL Approval.
 

 

Testing procedures 

* Visual Inspection

* Flying probe

* Impedance control

* Solder-ability detection

* Digital metallograghic microscope

*AOI (Automated Optical Inspection) 
 

Technology capability 

 

Items		Single/Double-sided Board/Multilayer Board/FPC(1-24Layer)
Base Materials		FR-4(High TG 150°-170°),FR1,Aluminum,CEM-3,BT,94vo
Finish copper thickness		Outer 6 OZ,Inner 4 OZ
Surface finish		ENIG, ImAg, ImSn, OSP, HASL,Plating gold
Finished Board Size		Max Double-sided Board	640mm χ 1100mm
		Max Multilayer Board	640mm χ 1100mm
Finished Board Hole Size (PTH Hole)		Min Finished Board Hole Size	0.15mm
Conductor Width and Spacing		Min Conductor Width	0.01mm
		Min Conductor Spacing	0.01mm
Thickness of Plating and Coating Layer		PTH Wall Copper Thickness	>0.02mm
		Tin Solder Thickness ( Hot  Air Leveling )	>0.02mm
		Nickl/Gold Thickness	For customer special need
		Nickl Plating Layer	>2um
		Gold Plating Layer	>0.3um
Bare Board Test	Single Side Test	Max Test Point	20480
		Max Board Test Size	400mm χ 300mm
	Double Side Test	Max Test Point	40960(General Use)
			4096(Special Use)
		Max Board Test Size	406mm χ 325mm
			320mm χ 400mm
		Min Test pitch of SMT	0.5mm
		Test Voltage	10-250V
Mechanical Process		Chamfer	20°, 30°, 45°, 60°
		Angle Tolerance	± 5°
		Deepness Tolerance	± 0.20mm
		V-Cut Angle	20°, 30°, 45°
		Board Thickness	0.1-3.2mm
		Residues Thickness	± 0.025mm
		Cell Paraposition Precision	± 0.025mm
Tolerance of Out-shape Process			± 0.1mm
Board Warp		Max Value	0.7%
Optical Plotting		Max Plotting Area	66mm χ 558.8mm
		Precision	± 0.01mm
		Repetitive Precision	± 0.005mm

We should be obliged if you should give us an early enquiry. And you can have a trial order first. Pls believe in our technological and producing capability.


Paymeny term:

T/T,Western Union,ect

Pls feel free to contact us if you are in need.

Shenzhen XinJiaYe Electonics Technology Co, . Ltd.